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FPC
- FPC
- Dual-Tank Pressurized Defoaming Machine
- Roll Material Laminating and Cutting Machine
- Hydraulic forming machine
- Automatic punching machine
- CCD Film Laminating Machine
- CCD Laminating Machine
- CCD Roll-to-Roll Printing Machine
- Screen printing
- Digital printing
- SMT
- CNC
- High-pressure molding
- Laser cutting
- Electrostatic control
FPC
Drilling
Drill bits: Ø0.1–6.2 mm
Materials processed: FCCL (copper-clad laminate), coverlay, EMI film, PET, and ITO film
Maximum size: 400 × 450 mm
Maximum capacity: 60,000 holes/hr
Electroplating
Materials processed: FCCL (double-sided copper-clad laminate), three-layer boards
Copper-plated board thickness: 0.4–1.6 mm
Maximum size: 250 × 420 mm
Maximum production capacity: 67.5 panels/hr (estimated based on 250 × 420 mm)
Exposure
Apply dry film to the copper-clad laminate, then place the circuit pattern photomask together with it and expose it to ultraviolet light. The dry film exposed to ultraviolet light undergoes a polymerization reaction, transferring the circuit pattern onto the dry film!
Processed Materials: FCCL copper-clad laminates and three-layer boards
| Exposure side count | Alignment accuracy | Maximum size | Maximum production capacity | Minimum line width (L/S) | |
| Manual exposure machine | Double-sided | 100um | 350*450mm | 144Panel/hr | 75um/75um |
| Double-Sided Automatic Alignment Parallel-Light Exposure Machine | Double-sided | 60um | 350*450mm | 102 Panel/hr | 75um/75um |
| Single-Sided Automatic Alignment Parallel Light Exposure Machine | Single-sided | 60um | 420*250mm | 90Panel/hr | 75um/75um |
Etching
Processed Materials: FCCL (Copper-Clad Laminate), Three-Layer Boards
Maximum size: 500 × 500 mm
Maximum capacity: 250 panels/hr
Developing: Removing the unpolymerized dry film on the copper-clad substrate that has not been exposed to ultraviolet light
Etching: Removing the copper without dry film on the copper-clad substrate after development to form the circuitry.
Stripping: Remove the dry film on the circuit that has undergone a polymerization reaction due to exposure to ultraviolet light.
Lamination
Materials processed: Coverlay, EMI film, PI stiffener, FR4 stiffener, and SUS stiffener (FR4 stiffeners, SUS stiffeners, and PI stiffeners of 5 mil or greater are only applicable to H46 vacuum hot press operations).
Maximum Size:
Vacuum laminating machine: 320 × 500 mm
80-ton fast press: 250 × 420 mm
100-ton fast press: 440 × 500 mm
Routing
Materials processed: Bakelite boards, acrylic, lead-free stone, light guide plates, panels, LENS, spacers, FR4, light-blocking posts, and diffusers
Maximum size: 450 × 420 mm