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SMT
- FPC
- Dual-Tank Pressurized Defoaming Machine
- Roll Material Laminating and Cutting Machine
- Hydraulic forming machine
- Automatic punching machine
- CCD Film Laminating Machine
- CCD Laminating Machine
- CCD Roll-to-Roll Printing Machine
- Screen printing
- Digital printing
- SMT
- CNC
- High-pressure molding
- Laser cutting
- Electrostatic control
SMT
SMT
Processing materials: silver paste and solder paste
IR maximum temperature: 350°C
Maximum processing area: 350 × 450 mm
Minimum processable component size: 0.3 × 0.15 mm (0201), 0.4 × 0.4 mm (IC)
Maximum processable IC size: 55 × 100 mm; component height: 15 mm
AOI Inspection: 2D + 3D + four-direction oblique-view inspection
SPI Inspection: 3D projection technology with dual-light-source digital fringe projection inspection that provides 100% shadow-free detection